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Raytheon To Solve Thermal Challenges In High-Power Radars
Tewkesbury MA (SPX) May 02, 2008 Raytheon has been awarded a $3.3 million contract to overcome thermal challenges in semiconductors designed for next-generation high-power radars and other electronic systems. The award is for the first of a three-phase Defense Advanced Research Projects Agency (DARPA) Radio Frequency Thermal Ground Plane program that could be worth $8 million if all options are exercised. The full three-phase program is designed to run 45 months beginning now and ending in the fourth quarter of 2011. "The Raytheon solution couples innovative nanostructured materials with optimized fluid systems and thermal expansion-matched packaging," said Mark Russell, vice president of Engineering at Raytheon Integrated Defense Systems (IDS). "This approach overcomes power density, total heat dissipation, and weight and fit limitations of current heat pipe technology to achieve up to 100 times the effective thermal conductivity of conventional packaging materials." Community Email This Article Comment On This Article Related Links The latest in Military Technology for the 21st century at SpaceWar.com 
Marine Snails Could Help Provide Better Armor For Soldiers
Riverside CA (SPX) May 01, 2008Marine snails, sea urchins, and other animals from the sea are teaching researchers in UC Riverside's Department of Chemical and Environmental Engineering how to make the world a better place. Consider, for example, the possibilities of designing a lightweight armor that would protect U.S. soldiers in Iraq from Improvised Explosive Devices. Or, what flexible ceramics might offer industry. Or, how everyone could benefit from new ways of producing and storing energy. |
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